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ADVANCE DATA SHEET
SKY77176 AutoSmartTM Dual-Band Power Amplifier Module for CDMA/PCS (824-849 MHz and 1850-1910 MHz)
Applications
* Digital cellular (CDMA) * Personal Communications Services (PCS) * Wireless local loop (WLL)
Description
The SKY77176 AutoSmartTM Power Amplifier Module (PAM) is a fully matched, 12-pin surface mount module developed for Code Division Multiple Access (CDMA) / Personal Communications Services (PCS) and Wireless Local Loop (WLL) applications. AutoSmartTM power amplifier technology internally adjusts the RF transistor bias level throughout the dynamic operating range to minimize battery current consumption and ensure sufficient linear performance to meet CDMA system requirements. The result is a significant savings in average battery current without the complications of a system-supplied mode function signal or analog bias control. AutoSmartTM response time is more than adequate for RF access probe and discontinuous transmission operation. Mode control is included to permit high-bias operation (disable AutoSmartTM) during high data transmission using CDMA2000 or 1xEVDO. This small and efficient module packs full coverage of the 824-849 MHz and 1850-1910 MHz bandwidths into a single compact package. The device meets the stringent IS95 CDMA linearity requirements up to and exceeding 28 dBm output power. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. Output match to a 50-ohm load is realized off-chip and within the module package to optimize efficiency and power performance. The SKY77176 AutoSmartTM PAM is manufactured with Skyworks' GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77176 is supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the 3.2 to 4.2 volt range. Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery.
Features
* Low voltage positive bias supply - 3.2 V to 4.2 V * Low VREF - 2.85 V, nominal * Low IREF - less than 1 mA * Good linearity * High efficiency * Large dynamic range * 12-pin package - 3 mm x 5 mm x 1.0 mm * Power down control * InGaP * IS95/CDMA2000/EVDO
Figure 1. Functional Block Diagram
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200409A * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * November 17, 2007
1
PRELIMINARY DATA SHEET * SKY77176
AUTOSMARTTM DUAL-BAND POWER AMPLIFIER MODULE FOR CDMA/PCS (824-849 MHZ AND 1850-1910 MHZ)
Electrical Specifications
The following tables list the electrical characteristics of the SKY77176 Power Amplifier. Table 1 lists the absolute maximum ratings, while Table 2 lists the recommended operating conditions for achieving the electrical performance listed in Table 4 (CDMA Cellular) and Table 5 (CDMA PCS). Table 3 presents a truth table for disable and band selection.
Table 1. Absolute Maximum Ratings 1
Parameter CW RF Input Power Supply Voltage Digital Control Voltage Reference Voltage Case Temperature 2
1 2
Symbol PIN VCC VMODE VREF Operating Storage TC TSTG
Minimum -- -- 0 -- -30 -55
Nominal 0.0 3.4 2.5 2.85 25 --
Maximum 7.0 6.0 3.0 3.0 +110 +125
Unit dBm Volts Volts Volts C
No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value. Case Operating Temperature refers to the temperature of the GROUND PAD at the underside of the package.
Table 2. Recommended Operating Conditions
Parameter Output Power CDMA Cell CDMA PCS Operating Frequency CDMA Cell CDMA PCS Supply Voltage Data Mode Autobias Reference Voltages Case Operating Temperature
1
Symbol PO
Minimum -- --
Nominal -- -- 836.5 1880.0 3.4 3.4 0.0 3.0 2.85 +25
Maximum 28.0 28.5 849.0 1910.0 4.2 4.2 0.5 -- 2.95 +85
Unit dBm
FO VCC 1 VMODE
824.0 1850.0 3.2 3.2 -- 2.5
MHz
Volts
VMODE Control Range
VMODE VREF_CELL VREF_PCS TO
Volts
2.75 -30
Volts C
Recommended minimum VCC for maximum output power is indicated. VCC down to 0.5 V may be used for backed-off output when using DC/DC converter to conserve battery current.
Table 3. Band Select Truth Table
Band Selection Cellular PCS Power Down (disable) VREF_CELL 2.85 V 0.0 V 0.0 V VREF_PCS 0.0 V 2.85 V 0.0 V
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November 17, 2007 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * 200409A
AUTOSMARTTM DUAL-BAND POWER AMPLIFIER MODULE FOR CDMA/PCS (824-849 MHZ AND 1850-1910 MHZ)
PRELIMINARY DATA SHEET * SKY77176
Table 4. Electrical Specifications for CDMA Cell Nominal Operating Conditions 1
Characteristics Digital Mode Gain Conditions Analog Mode Power Added Efficiency (VCC = 3.4 V) Digital Mode Analog Mode Total Supply Current Symbol GLOW GHIGH GP PAED_LOW PAED_HIGH PAEa ICC_LOW ICC_HIGH Total Supply Current in Power-down Mode Quiescent Current Reference Current Adjacent Channel Power 2,3 885 kHz offset 1.98 MHz offset Harmonic Suppression Second Third Noise Power in RX Band 869-894 MHz Noise Figure Input Voltage Standing Wave Ratio Stability (Spurious output) Ruggedness--No damage 4 Turn On Time 5 DC RF Turn Off Time 5
1 2 3
Condition PO_D 0 dBm PO_D = 28 dBm PO_A = 31 dBm PO_D = 16 dBm PO_D = 28 dBm PO_A = 31 dBm PO_D = 16 dBm PO_D = 28 dBm VCC = 3.4 V VREF = 0 V
Minimum -- -- -- -- -- -- -- -- -- -- --
Typical 21.0 28.0 27.0 9 40 55 130 450 2.0 20 1.0 -49 -60 -35 -55 -139 4.0
Maximum -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 2.0:1
Unit
dB
%
mA
IPD ICQ IREF ACP1 ACP2 f02 f03 RxBN NF VSWR S Ru TONDC TONRF TOFFDC TOFFRF
A mA mA dBc
PO_D 28 dBm PO_D 31 dBm PO_D 28 dBm
-- -- -- -- -- -- --
dBc dBm/Hz dB
5:1 VSWR all phases PO_D 28 dBm
-- 10:1 -- -- -- --
-- -- 40 5 40 5
-70.0 -- -- -- -- --
dBc VSWR s
DC RF
s
Per Table 2 over dynamic range up to 28 dBm output power, unless otherwise specified. ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. For CDMA2000 test configured as [PCH @ -3.75 dB, DCCH-9600 bps @ 0 dB; SCHO-9600 bps @ 0 dB] and other test configurations that yield a peak-to-average up to 4.5 dB for CCDF = 1%, up to 1. dB power back off from the maximum listed for IS95 may be required to meet specified maximum ACP performance under worst-case conditions. All phases, time = 10 seconds. TONDC is time required to reach stable quiescent bias (10%) after VREF is switched high. TOFFDC is time required for battery to decrease to < 100 A after VREF is switched low. After ICQ is stable, The TONRF is time to reach final output power (1 dB) once RF input is applied. TOFFRF is time required for PO to drop 30 dB once RF input is removed.
4 5
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200409A * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * November 17, 2007
3
PRELIMINARY DATA SHEET * SKY77176
AUTOSMARTTM DUAL-BAND POWER AMPLIFIER MODULE FOR CDMA/PCS (824-849 MHZ AND 1850-1910 MHZ)
Table 5. Electrical Specifications for CDMA PCS Nominal Operating Conditions 1
Characteristics Gain Conditions Symbol GLOW GHIGH Power Added Efficiency (VCC = 3.4 V) PAED_LOW PAED_HIGH Total Supply Current ICC_LOW ICC_HIGH Total Supply Current in Power-down Mode Quiescent Current Reference Current Adjacent Channel Power 1.25 MHz offset 1.98 MHz offset Harmonic Suppression Second Third Noise Power in RX Band 1930-1990 MHz Noise Figure Input Voltage Standing Wave Ratio Stability (Spurious output) Ruggedness--No damage 2 Turn On Time 3 DC RF Turn Off Time 3
1 2 3
Condition PO 0 dBm PO = 28 dBm PO = 16 dBm PO = 28 dBm PO = 16 dBm PO = 28 dBm VCC = 3.4 V VREF = 0 V
Minimum -- -- -- -- -- -- -- -- --
Typical 23.0 28.0 10 40 120 470 2.0 20 1.0 -50 -55 -55 -45 -139 4.0
Maximum -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 2.0:1
Unit dB
%
mA
IPD ICQ IREF ACP1 ACP2 f02 f03 RxBN NF VSWR S Ru TONDC TONRF TOFFDC TOFFRF
A mA mA dBc
-- -- PO 28 dBm PO 28 dBm
-- -- -- -- -- -- --
dBc dBm/Hz dB
5:1 VSWR all phases PO 28 dBm -- -- -- --
-- 10:1 -- -- -- --
-- -- 40 5 40 5
-70.0 -- -- -- -- --
dBc VSWR s
DC RF
s
Per Table 2 over dynamic range up to 28 dBm output power, unless otherwise specified. All phases, time = 10 seconds. TONDC is time required to reach stable quiescent bias (10%) after VREF is switched high. TOFFDC is time required for battery to decrease to < 100 A after VREF is switched low. After ICQ is stable, The TONRF is time to reach final output power (1 dB) once RF input is applied. TOFFRF is time required for PO to drop 30 dB once RF input is removed.
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com 4
November 17, 2007 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * 200409A
AUTOSMARTTM DUAL-BAND POWER AMPLIFIER MODULE FOR CDMA/PCS (824-849 MHZ AND 1850-1910 MHZ)
PRELIMINARY DATA SHEET * SKY77176
Evaluation Board Description
The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the SKY77176, the evaluation board schematic and evaluation board assembly diagram are included for preliminary analysis and design. Figure 2 shows the basic schematic diagram of the Evaluation Board Assembly for the 824 to 849 MHz and the 1850 to 1910 MHz ranges shown in Figure 3.
Figure 2. Evaluation Board Schematic
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200409A * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * November 17, 2007
5
PRELIMINARY DATA SHEET * SKY77176
AUTOSMARTTM DUAL-BAND POWER AMPLIFIER MODULE FOR CDMA/PCS (824-849 MHZ AND 1850-1910 MHZ)
Figure 3. Evaluation Board Assembly Diagram
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com 6
November 17, 2007 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * 200409A
AUTOSMARTTM DUAL-BAND POWER AMPLIFIER MODULE FOR CDMA/PCS (824-849 MHZ AND 1850-1910 MHZ)
PRELIMINARY DATA SHEET * SKY77176
Package Dimensions and Pad Descriptions
The SKY77176 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 4 is a mechanical drawing of the pin layout for this package. Figure 5 provides a recommended phone board layout footprint for the PAM to help the designer attain optimum thermal conductivity, good grounding, and minimum RF discontinuity for the 50-ohm terminals. Figure 6 shows the pin names and the pin numbering convention, which starts with pin 1 in the upper left and increments counter-clockwise around the package. Figure 7 illustrates typical case markings.
0.58 0.05
3
C B
(0.1)
0.48 0.1 METAL PAD EDGE (0.05) 0.48 0.05
PIN 1 INDICATOR
DETAIL A PAD SCALE: 2X 4X THIS ROTATION 4X ROTATED 180 0.48 0.1 (0.05) 0.59 0.05 (0.1) DETAIL B PAD SCALE: 2X 1X THIS ROTATION 1X ROTATED 180 1X ROTATED 90 CW 1X ROTATED 90 CCW DETAIL 0.44 0.05 (0.1) 0 2X 0.075
5
0.15 A B C
TOP VIEW C
12X 1.4
2X 2.325
PIN 12 2X 2.18 2X 1.49 2X 0.35 0 2X 0.45 2X 1.32 2X 2.18 A 1 MAX 0.1
0
PIN 1 INDICATOR (0.2 X 45) PIN 1
A C
B
2X 0.675
12X SMT PAD 0.15 A B C SOLDER MASK OPENINGS 0.2 A B C
200409_004
4X 2.4
SIDE VIEW
BOTTOM VIEW
Figure 4. SKY77176 Package Dimensional Drawing (All Views)
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200409A * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * November 17, 2007
7
PRELIMINARY DATA SHEET * SKY77176
AUTOSMARTTM DUAL-BAND POWER AMPLIFIER MODULE FOR CDMA/PCS (824-849 MHZ AND 1850-1910 MHZ)
PIN 1 INDICATOR 2X 2.33
3.3 12X 0.73 1.35
A
2X 2.18 2X 1.49
A
8X 0.48 2X 2.18 2X 1.49
C
C
8X 0.58
2X 0.35 0 2X 0.08 2X 0.45 2X 1.32 2X 2.18 Package Outline 4X 0.44 (Marked A) 4.65
2X 0.35 0 2X 0.45 2X 1.32 2X 2.18 4X 0.54 (Marked C)
A
2X 0.68
A
0.25 TYP Package Outline
C
0.2 TYP 3.4
C
12X 0.83
STENCIL APERTURE
TOP VIEW Stencil aperture size for Center Ground Pad should be 80%-100% (by area) of the Solder Mask Opening package.
SOLDER MASK OPENING
TOP VIEW
3.3 0.25 TYP
Common Ground Pad represents the merger of the module Center Ground Pad and two individual I/O Ground pads. Therefore the number of places dimensioned is reduced.
2.18 2X 1.49
B
7X 0.48 Thermal Via Array O0.3 mm on 0.6 mm Pitch Additional vias will improve thermal performance. NOTE: Thermal Vias should be tented and filled with solder mask 30-35 m Cu plating recommended 2X 0.45
2X 0.35 0.6 1.32 2X 2.18 Package Outline 0
3X 0.44 (Marked B)
B
0.3 0.6
B
12X 0.73
METALLIZATION
TOP VIEW
All dimensions are in millimeters.
200409_005
Figure 5. Phone PCB Layout Footprint for 3 x 5, 12-Pad Package - SKY77176
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November 17, 2007 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * 200409A
AUTOSMARTTM DUAL-BAND PA MODULE FOR CDMA/PCS (824-849 MHZ AND 1850-1910 MHZ)
PRELIMINARY DATA SHEET * SKY77176
should not exceed 250 C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 250 C for more than 10 seconds. For details on both attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Skyworks Application Note: Tape and Reel Information - RF Modules, Document Number 101568.
Electrostatic Discharge Sensitivity
Figure 6. SKY77176 Pad Configuration and Pad Names (Top View)
The SKY77176 is a Class 1C device. Figure 8 lists the Electrostatic Discharge (ESD) immunity level for each pin of the SKY77176 product. The numbers in Figure 8 specify the ESD threshold level for each pin where the I-V curve between the pin and ground starts to show degradation. The ESD testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model. If ESD damage threshold magnitude is found to consistently exceed 2000 volts on a given pin, this so is indicated. If ESD damage threshold below 2000 volts is measured for either polarity, numbers are indicated that represent worst case values observed in product characterization.
Figure 7. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY77176 is capable of withstanding an MSL3/250 C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 C per second; maximum temperature
Figure 8. SKY77176 ESD Sensitivity Areas (Top View)
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200409A * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * November 17, 2007
9
PRELIMINARY DATA SHEET * SKY77176
AUTOSMARTTM DUAL-BAND POWER AMPLIFIER MODULE FOR CDMA/PCS (824-849 MHZ AND 1850-1910 MHZ)
Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards, which fail devices only after "the pin fails the electrical specification limits" or "the pin becomes completely nonfunctional". Skyworks employs most stringent criteria and fails * Personnel Grounding - Wrist Straps - Conductive Smocks, Gloves and Finger Cots - Antistatic ID Badges * Protective Workstation - Dissipative Table Top - Protective Test Equipment (Properly Grounded) - Grounded Tip Soldering Irons - Solder Conductive Suckers - Static Sensors
devices as soon as the pin begins to show any degradation on a curve tracer. To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class-1 ESD handling precautions listed below. * Facility - Relative Humidity Control and Air Ionizers - Dissipative Floors (less than 109 to GND) * Protective Packaging and Transportation - Bags and Pouches (Faraday Shield) - Protective Tote Boxes (Conductive Static Shielding) - Protective Trays - Grounded Carts - Protective Work Order Holders
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November 17, 2007 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * 200409A
Ordering Information
Model Number SKY77176 Manufacturing Part Number SKY77176 Product Revision Package Operating Temperature -30 C to +85 C
Revision History
Revision A Level Date November 17, 2007 Initial Issue - Preliminary Information Description
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Application Note: Tape and Reel Information - RF Modules Document Number 101568 JEDEC Standard J-STD-020
Copyright (c) 2005-2006, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its documentation, products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its documentation, products, specifications and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by or under this document. Except as may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever in association with its documentation, products, specifications and product descriptions. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED OR OTHERWISE, RELATING TO SALE AND/OR USE OF SKYWORKS PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks' customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: SkyworksTM, the Skyworks logo, and Breakthrough SimplicityTM. Product names or services listed in this publication are for identification purposes only, and may be trademarks of Skyworks or other third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.

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